HDI PCB IPC-6012F Automotive Certification and CCL Substrate Evaluation Guide 2026 | SCM Group HK
The publication of IPC-6012F in 2026 has substantially updated qualification and performance requirements for rigid printed circuit boards, with the most significant changes affecting HDI boards destined for automotive and high-reliability applications. The new revision tightens microvia aspect ratio limits to 0.75:1 for Class 3 automotive boards, introduces additional inspection criteria for sequential lamination layer interfaces, and mandates more stringent copper distribut
18 minutes ago
Intensive Mixer Specification and Selection Guide 2026: Refractory Ceramic and Battery Granulation | SCM Group HK
The intensive mixer has become the cornerstone of advanced powder processing across two of the fastest-growing industrial sectors in 2026: refractory ceramics and lithium battery material granulation. As global EV production ramps toward 40 million units annually, the need for precisely controlled granulation of cathode active materials - including NMC and LFP powders - has intensified sharply. Intensive mixers deliver rotor tip speeds of 20-35 m/s and generate shear forces i
19 minutes ago
HDI PCB IPC-6012 Certification 2026: Complete Qualification Guide for Automotive CCL Substrates | SCM Group HK
IPC-6012 remains the primary qualification and performance standard for rigid printed circuit boards, with its latest 2026 revision emphasizing enhanced requirements for automotive and high-reliability electronic assemblies. As automotive HDI PCB demand accelerates driven by ADAS sensor arrays, battery management systems, and EV powertrain control units, buyers and suppliers must demonstrate compliance with IPC-6012 Class 2 and Class 3 performance specifications. The standard
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