HDI PCB IPC-6012 Certification Standards 2026: Supplier Evaluation & Substrate Material Selection | SCM Group HK
IPC-6012 Revision F (2026) introduces significant updates for HDI PCB qualification, particularly for automotive-grade electronics. The most impactful change is mandatory IST (Interconnect Stress Test) for all stacked microvia structures with 3 or more levels in Class 3 products. Automotive HDI PCBs must simultaneously comply with IPC-6012 Class 3, IPC-2226 design rules, IATF 16949 manufacturing certification, and AEC-Q100 component qualification. In 2026, the automotive PCB
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Intensive Mixer Specification Selection Guide 2026: Process Parameters & Material Requirements | SCM Group HK
Selecting the right intensive mixer for refractory, ceramic, and lithium battery granulation requires careful analysis of material properties, required particle size, and production capacity. In 2026, global demand for intensive mixers in battery material processing grew by approximately 18%, driven by the expansion of solid-state battery manufacturing and EV market growth. Key parameters include effective volume utilization (50–70%), rotor tip speed (3–12 m/s), granulation e
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HDI PCB IPC-6012 Certification Standards 2026: Automotive Qualification & CCL Substrate Evaluation | SCM Group HK
HDI (High Density Interconnect) PCB qualification and supplier evaluation in 2026 demands rigorous adherence to IPC standards—particularly IPC-6012 for rigid board performance qualification and IPC-2226 for HDI design requirements. As automotive electronics integration intensifies, driven by ADAS radar modules, EV battery management systems, and vehicle-to-everything (V2X) communication hardware, the stakes for PCB quality assurance have never been higher. The global automoti
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